Card Anatomy & EMV Chip Cryptography
Deep principal engineering guide to payment card physical/logical anatomy, ISO/IEC 7812 PAN structure, Luhn Mod 10 checksum, Track 1/2 magstripe, and EMV chip cryptography (ARQC, ARPC, TC, AAC, SDA, DDA, CDA).
Deep principal engineering guide to payment card physical/logical anatomy, ISO/IEC 7812 PAN structure, Luhn Mod 10 checksum, Track 1/2 magstripe, and EMV chip cryptography (ARQC, ARPC, TC, AAC, SDA, DDA, CDA).
Comprehensive principal engineering guide to card transaction processing models (SMS vs DMS), clearing file formats (Visa BASE II, Mastercard IPM), Merchant Discount Rate (MDR) economics, and Interchange++ vs Blended pricing.
Deep principal engineering guide to card messaging wire protocols — ISO 8583 versions, MTI anatomy, 64/128-bit bitmaps, data elements catalog, Australian AS 2805 standard, and production Java 21 authorization engine.
Comprehensive principal engineering guide to global payment card schemes, open-loop (4-party) vs closed-loop (3-party) operating models, scheme switch topologies, and architectural trade-offs against real-time account-to-account rails.
Comprehensive principal engineering guide to card dispute management, 4-stage chargeback lifecycles, Visa Compelling Evidence 3.0 (CE3.0), Australian Dual-Network Debit Cards (DNDC), and Least-Cost Routing (LCR) mechanics.
Comprehensive principal engineering guide to card security architectures — EMVCo Network Tokenization (VTS, MDES, Apple Pay DPAN), Account Updater, dynamic cryptograms (TAVV/DSRP), EMV 3-D Secure 2.2/2.3 protocol, liability shifts, and PCI-DSS scope reduction.